IANS | 17 Jan, 2024
Taiwanese contract manufacturing giant Foxconn has said that it is
teaming up with HCL Group to start a chip packaging and testing venture
in India, a media report said on Wednesday.
According to a
regulatory filing to Taiwan's stock exchange, Foxconn Hon Hai Technology
India Mega Development, a division of the Taiwanese contract
manufacturer, will invest $37.2 million for a 40 per cent ownership in
the joint venture, reports Moneycontrol.
The chip packaging and
testing venture, called OSAT in industry lingo, comes after Foxconn
abandoned a joint venture with Anil Agarwal-led Vedanta in July last
year.
HCL Group had earlier announced that it was in active talks
to establish an OSAT facility with the state government of Karnataka,
the report mentioned.
This development comes after the company
submitted a fresh application to establish a semiconductor fabrication
unit in India under the “modified scheme for setting up semiconductor
facilities in India" -- a government initiative aimed at promoting the
electronics manufacturing sector, including semiconductors, the report
added.
“Foxconn has to bring in technology. They have to establish
that they have the technology to manufacture semiconductors. The
process of verifying the technology and so on is currently underway at
the ministry,” a government official was quoted as saying.
Meanwhile,
Foxconn has received approval to invest at least $1 billion more in a
plant in India that will manufacture Apple products, a significant step
towards its aim of establishing a hub outside of China.